31/08/2022
Biasiswa Innovalues Bonded Scholarship
- Listed: July 25, 2022 2:53 pm
Description
OBJECTIVE
The programme is intended to reach out to deserving Malaysians who are in need of financial aid to pursue their education.
WHAT DOES THE SCHOLARSHIP OFFER?
– Up to a maximum of RM8,000 SCHOLARSHIP AMOUNT per year
– Bond scholarship, the recipients will guarantee job post graduate.
– Induction Programme : An induction programme will be provided to all recipients of the
Innovalues Scholarship program.
REQUISITES AND CONDITIONS
1. Malaysian citizen and a full-time student between 18 – 25 years old.
2. Student waiting for admission to pursue a full-time degree course at local government university/ college. Or,
3. Existing Degree student
4. Household income not exceeding RM5,000.00 per month.
5. Field of Study: –
i. Mechanical Engineering Automotive Engineering
ii. Manufacturing/ Industrial Engineering or Manufacturing System or equivalent
iii. Mechatronics Engineering
iv. Electronic Engineering
6. English and Math at least “B” in SPM result.
7. Recognized foundation/Diploma equivalent to CGPA 3.0 or above.
8. Successful recipients must maintain a full-time student status and maintain a minimum CGPA of 3.0 in every semester without failing any subjects.
9. The Scholars must not be bonded by other body or organization.
10.The successful student will serve under Innovalues 3 years compulsory service after completed study.
Apply Now at: https://forms.office.com/r/8EJWa02hx7
Any quiry, please email to: wschew@innovalues.com | Closing Date: 31 August 2022
INNOVALUES PRECISION SDN. BHD. (Co. No.: 454311-D)
Address: PLO 505, Jalan Keluli 3, Pasir Gudang Industrial Estate, 81700 Pasir Gudang, Johor.
Tel: 607- 2536 000
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