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30/06/2023

Biasiswa Hong Leong Scholarship

  • Listed: June 22, 2023 12:15 am

Description

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Hong Leong Foundation Scholarship

The Hong Leong Foundation offers scholarships to Malaysians intending to pursue further studies in Diploma or Undergraduate Degree programme. The scholarship is offered annually and the call for application starts on 1st April and ends 31st of May each year. However, please be informed that the call for applications for this year (2022) has been postponed to May 15th and ends on June 30th.

The scholarship is awarded to those pursuing in Diploma, Advanced Diploma or Undergraduate Studies (1st degree course in ANY course or field of studies on full time basis at recognised public and private universities and colleges in Malaysia.

The selected scholarship recipient will receive:

Undergraduate courses in Public Universities
RM 8,500 / = p.a.
Diploma/Advanced Diploma courses in Public & local Private Universities
RM 6,000 / = p.a.
Undergraduate studies at local private universities (“3+0” degree programmes on full-time and on-campus basis)
up to RM24,000 / = p.a.
Medicine/Dentistry courses in local Private Universities
up to RM32,000 / = p.a.

 

The HLF Undergraduate Scholarship is a non-bonding scholarship.

Apply Now

Contact Info

Address:

The Hong Leong Foundation Secretariat at scholarships@hongleong.com.my

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Carian Biasiswa 2023


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